TH35-E3930
3.5″ Apollo Lake Industrial Embedded Motherboard with E3930 CPU support -40°C to +85°C operating temperature
Data sheet (PDF)
| CPU | Intel Apollo Lake-I E3930, Dual-core, 1.3 GHz, TDP 6.5W |
| Chipset | SoC integrated |
| System Memory | DDR3L-1867, 1 x 204-pin SO-DIMM, up to 8GB |
| BIOS | AMI |
| COM | 4 x RS-232, one support RS-232/422/485) |
| USB | 4 x USB 3.0 2 x USB 2.0 |
| Ethernet | 2 x RJ-45, Intel I210 Giga LAN |
| Display | 1 x HDMI (Up to 3840 x 2160 @ 30Hz) 1 x VGA (Up to 1920 x 1200 @ 60Hz) 1 x LVDS (Up to 1920 x 1200 @ 60Hz) (Default) 1 x eDP (Up to 3840 x 2160 @ 60Hz) (Optional) |
| Digital I/O | Programmable support 10-bit GPIO |
| Audio | 1 x Audio Header (Front Panel Mic-in & Line-out) |
| Storage | 2 x SATA 3.0 (1 x SATA is multiplexed with 1 x mSATA port) |
| Expansion | 1 x Mini-PCIe Full size (USB/PCIe/SATA), with SIM Card Holder 1 x M.2 2230 E key (PCIe/USB) |
| Others | 1 x 4-pin CPU Fan Header 1 x 8-24V ATX Power Connector, 1 AT/ATX Mode Select Jumper 1 x CMOS Jumper 1 x CMOS Clear Jumper |
| Battery | - |
| Power Requirements | 8-24V Wide Range DC Input with 4-pin ATX connector |
| Watchdog Timer | 1 - 255 steps by software program |
| Hardware Monitoring | - |
| Operating Temperature | -40°C to +85°C (-40°F to +185°F) |
| Relative Humidity | 10% to 95% relative humidity, non-condensing |
| Dimensions | 146 x 105 mm, 3.5-inch |
| Board Thickness | - |
| Certifications | CE, FCC Class B |
