MFI-5GXM Book Size PCˇ@
Specification


Motherboard specification:
All in one designed with VGA , LAN , sound on board.
Industrial circuit and components designed.
Chip sets: NS GX1-300 + CS5530A
CPU: NS GX1-300 low power CPU embedded
Lan : 1x 10/100 Mbit on board
USB port: 2 ports
Disk On chip : socket supported
COM ports : 4 COM ports ( +5 V power supported on COM 3 & 4 )

Case size : 30cm ( w ) x 23cm ( L ) x 6cm ( H )
Power supply : Internal power supply 80watts 110V/230V switchable
Riser card : 1 slots PCI or ISA
Drive bay : 1 x 3 1/2 ˇ§ HDD +
1 x 3 1/2 ˇ§ FDD or HDD
MFI-5GXM / MFII-5GXM MOTHERBOARD ENGINEERING SPECIFICATIONS

Product Name MFI5233
Form Factor Customer Size
CPU Type NS Geode GX1-300 Mhz fan less low power CPU embedded
CPU Voltage 2.0 V
System Speed NS Geode GX1-300 Mhz fan less , 233 Mhz optional
CPU External Clock 66 Mhz
Chipset
NS GX1-300 Mhz CPU + CS 5530A
BIOS Award BIOS
Cache 32 K Level2 (CPU integrated)
DiskOnChip Supports M-system 2MB~288MB DiskOnChip flash disk
UART/16550A (4 Ports)
( COM 3 & 4 optional ) COM1/2/3/4:RS232 w/16 Byte FIFO
Jumper selectable for +5V at pin 9 of DB9 for COM 3 , 4
On Board VGA NS GX1 chip set with Integrated SVGA Graphic
1/2/3/4 MB frame buffer using system memory

LAN Realtek 8139C ( 8139C+ ) Single Chip Ethernet Controller
10/100 BaseT support
Sound ( optional ) NS CS5530A chip set with Built-in Sound controller + AC97 Codec ( optional )
Memory type
1x 168-Pin DIMM 3.3V Max. 512 MB
Support PC100/PC133 DIMM Module
SUPER I/O WINBOND W83977F: IrDAx1 Parallel x1, Serial*2, FDC 2.88MB (3 Mode support ),
WINBOND W83877F:Serial*2 for COM 3 & 4
RTC/CMOS WINBOND W83977F Built-in
Battery Lithium Battery
Keyboard Controller WINBOND W83977F
EPP/ECP Yes
USB 1.1 x 2 ports 2 ports, transfer rate up to 12Mb/s , in the front panel
Expansion Slot EISA Slot (PCI/ISA)
Board Size Customer Size
Operating Temperature 0˘XC~60˘XC (32˘XF~140˘XF)
Storage Temperature -20˘XC~80˘XC (-68˘XF~176˘XF)
Relative Humidity 10%~90% (non-condensing )
MTBF 70000 hours